Reexen secures near RMB200m Series B++ for AI chip development
Industrial investors support the Shenzhen company’s model, processor and memory architecture.
Reexen Technology completed a Series B++ financing of nearly RMB 200 million, reported on 22 April 2026. Participants included OmniVision Group and China Merchants Zhiyuan Capital, alongside returning investors Gettop Acoustic and Yinghao Capital. An unnamed industrial investor led the round.
The financing supports development of the company’s MPM approach, which designs models, processors and memory together. Reexen plans to strengthen chip and system architecture, product development and industrial partnerships.
The Shenzhen company develops compute-in-memory technology for AI systems, aiming to reduce the data movement that constrains inference performance and energy efficiency.
Use of funds
Develop model-processor-memory architecture and chips
Expand product and industrial partnerships