Reexen raises over RMB100m Series B for compute-in-memory chips
The Shenzhen company funds chip development, ecosystem partnerships and recruitment.
Reexen Technology announced a Series B exceeding RMB 100 million on 24 September 2025. Investors included Oriza Puhua, Waniu Capital, Ningbo Zhenhai Hanyun Equity Investment and Gaoshan Xinyu, with returning backing from Weihao Chuangxin and MiraclePlus.
The capital supports development of the company’s next generations of compute-in-memory chips, customer and supplier partnerships, and technical and commercial recruitment.
The Shenzhen company combines memory and processing architectures to reduce data movement in AI systems. Its work covers inference applications spanning devices, edge systems and cloud infrastructure.
Use of funds
Develop next-generation compute-in-memory chips
Expand customer and supplier partnerships
Recruit technical and commercial talent