Reexen Technology adds investors for compute-in-memory AI chips
The new equity financing supports chip development, software and cloud-to-device deployment.
Reexen Technology announced new equity financing on 22 October 2026, with Zhiwei Capital, miHoYo, Yinghao Capital and Weihao Chuangxin participating. The amount of the latest financing was not disclosed separately from the company’s reported RMB 1 billion raised across multiple rounds over six months.
The funding will support HBF and SRAM compute-in-memory chip development and tape-outs, the MPM software stack and products spanning cloud, edge and device applications.
Founded in Shenzhen by Liu Hongjie, Reexen designs memory and processors together to reduce the cost and energy involved in moving data for AI inference. Yinghao Capital and Weihao Chuangxin are returning investors.
Use of funds
Develop HBF and SRAM compute-in-memory chips and tape-outs
Build MPM software stack and expand cloud, edge and device products