TeRAM
United States · Hardware · AI
A semiconductor company developing custom three-dimensional SRAM memory to increase bandwidth and capacity for AI computing chips.
Adding fast memory close to AI compute
TeRAM is developing memory and packaging technology that stacks custom 3D SRAM directly onto AI compute chips. The design aims to increase memory capacity and bandwidth while reducing power consumption, addressing a bottleneck as large AI models demand more data movement between processors and memory.
The company is validating the technology and says it is targeting initial customer production in 2029, with AI data centers as the initial application. The product is therefore in development rather than commercially deployed; its financing supports work toward bringing the memory platform to production.
- Headquarters
- Los Altos, California, United States
- Product stage
- Technology validation; initial customer production targeted for 2029
- Initial market
- AI data centers
Funding history
1 round · 1 with disclosed amounts| Announced | Round | Amount | Investors |
|---|---|---|---|
| Funding | $37M | B Capital — LeadHyperion — LeadPrimary — LeadSemiAnalysis Capital — LeadAlumni Ventures — ParticipantLightscape Partners — Participant |