Advance Composite receives Series B investment from TEL Venture Capital
The materials developer will strengthen semiconductor-equipment applications and production capabilities through its connection with Tokyo Electron’s venture arm.
Advance Composite has completed a Series B share allotment involving TEL Venture Capital, Tokyo Electron’s corporate venture arm, and other subscribers. The company announced the investment on August 31, 2026, without disclosing the financing amount.
Developing the partnership
The proceeds will support research and development of high-performance composite materials for semiconductor applications, alongside product development and stronger mass-production capabilities. Tokyo Electron’s industry knowledge and network are intended to help bring the materials into use.
Advance Composite combines metals such as aluminium with ceramics or graphite through a proprietary squeeze-casting process. The resulting materials can combine thermal conductivity, rigidity, low weight and vibration damping—properties relevant to semiconductor equipment, data centres and other precision applications.
Use of funds
Develop composite materials for semiconductor equipment
Strengthen product development and mass production