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Lightspring
France · Industrial tech · Hardware
LightSpring develops 3D optical-interconnect manufacturing technology that precisely connects photonic chips, fibers and light sources.
Product and customers
LightSpring uses direct-write 3D lithography to fabricate optical connections between photonic components. The process automatically aligns each interconnect to the materials, geometry and optical properties of the chip, fiber or light source, with the company reporting sub-0.1-micron tolerance.
The platform is designed for photonics and optical-hardware manufacturers facing a difficult chip-integration step. LightSpring is moving the process from laboratory work toward production, with the aim of making photonic integration more repeatable and scalable.
- Product focus
- Direct-write 3D optical interconnect fabrication
Funding history
1 round · 1 with disclosed amounts| Announced | Round | Amount | Investors |
|---|---|---|---|
| Seed | €3.1M | Atlantic — LeadOVNI Capital — LeadConcept Ventures — ParticipantIxcore — ParticipantPlug and Play Ventures — Participant |