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Accelsius
United States · Hardware · AI · Enterprise software
Two-phase liquid cooling for data centres running dense AI and high-performance computing workloads.
Removing heat at the chip
Accelsius develops NeuCool, a direct-to-chip cooling platform for data-centre and edge operators. It circulates non-conductive fluid in a two-phase loop to remove heat from processors. The platform scales from individual racks to larger facilities, helping operators accommodate the thermal demands of high-density computing.
Funding history
1 round · 1 with disclosed amounts| Announced | Round | Amount | Investors |
|---|---|---|---|
| Series B | $65M | Johnson Controls — Role not disclosedLegrand — Role not disclosed |